Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporised Hydrogen Peroxide (VHPTM) using V-PRO s2 Low Temperature Sterilisation System.

Master Bond EP21ARHTND-2 is a two-part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals.

Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation.

Master Bond UV15DC80-1Med presents a unique dual-cure mechanism, combining UV light for initial setting with heat for full polymerisation.

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilised for underfill, coating, impregnating, and porosity sealing applications.

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special colour changing feature.

Master Bond Supreme 11AOHTMed is a two-component epoxy featuring thermal conductivity and electrical insulation.

Master Bond UV23FLDC-80TK epoxy is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms.

Designed for medical device manufacturing, MasterSil 711Med passes ISO 10993-5 testing.

Master Bond EP40TCMed is a two-part, room-temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity.

Master Bond LED415DC90 is a one-component adhesive system that cures rapidly upon exposure to a 405nm wavelength LED light source without any oxygen inhibition.

Master Bond EP41S-5Med is a two-part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices.

Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications.

Master Bond EP5TC-80 is a thermally conductive, electrically insulating, one part epoxy system for bonding, sealing and small encapsulating applications. It meets NASA low outgassing requirements.

Master Bond MasterSil 323AO-LO is a two-component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications.

Master Bond EP4CL-80Med is a one-part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilisation cycles and passes ISO 10993-5 testing for non-cytotoxicity.

It has a moderately high glass transition temperature (Tg) of 150-155°C and a wide service temperature range from -150°F to +550°F. Designed to compensate for thermal mismatches, this compound resists impact, vibration, shock and rigorous thermal cycling.

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.

Master Bond EP21TP-2NV is a two part epoxy polysulfide hybrid formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863. 

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilised for encapsulation and bonding. Supreme 3CCM-85 cures within two to three hours at 80-85°C, which is advantageous for use on heat sensitive components and substrates.