Tensilica: HiSilicon, a Division of Huawei, Licenses Tensilica's Xtensa Dataplane Processor and ConnX DSP IP Cores

We conducted a thorough review and evaluation of licensable DSP IP cores before selecting Tensilica, stated Teresa He, Vice President of HiSilicon. Tensilica's unique ability to combine world-class DSP capability with the flexibility and customization of the Xtensa DPUs gives HiSilicon the opportunity to strongly differentiate our products. We feel this will give us a strong competitive advantage.

We are pleased that HiSilicon, a world leader in mobile wireless, has selected Tensilica's DPUs and ConnX DSP cores, stated Tensilica president and CEO Jack Guedj. Their data-intensive, high-throughput and power efficient applications are an ideal match for our customizable DPUs.