Tensilica today announced that ComplexIQ is now a DPU IP integration partner. ComplexIQ has extensive expertise in MoCA networking design, offering optimized Xtensa DPUs for integration with its MoCA network interface IP blocks.

Tensilica have today revealed that Algotochip has joined its Xtensions partner network and will offer design services that incorporate Tensilica’s dataplane processor units. Algotochip now has access to Tensilica’s technology to help it market and deploy innovative solutions that will enable developers to get their Tensilica-based products to market faster.

Tensilica, Inc. and AM3D A/S today announced that the two companies have extended their partnership to port AM3D’s Audio Enhancement product to Tensilica’s family of HiFi Audio DSPs. This will provide enhanced audio experiences for mobile phones, in-car entertainment, home entertainment systems and PCs.

Tensilica and AM3D A/S today announced that the two companies have extended their partnership to port AM3D’s Audio Enhancement product to Tensilica’s family of HiFi Audio DSPs. This will provide enhanced audio experiences for mobile phones, in-car entertainment, home entertainment systems and PCs.

Tensilica and Sensory today announced that the two companies have worked together to provide the lowest power voice activation solution based on Tensilica’s recently introduced HiFi Mini DSP (digital signal processor) IP core and Sensory’s TrulyHandsfree always-on voice activation technology.

Tensilica reveal that it has strengthened its strategic relationship with Huawei. HiSilicon, the semiconductor division of Huawei, is expanding its use of Tensilica’s DPUs, including Tensilica’s Xtensa customizable processor technology, HiFi DSPs for audio and voice processing in smartphones and set-top boxes, and ConnX Baseband Engines for LTE base stations, handsets, and other network infrastructure and customer premise equipment.

Tensilica will be demonstrating NTT DOCOMO’s ARROWS X F-02E smartphone at its booth #6D101 at the Mobile World Congress show in Barcelona, Spain, February 25-28, 2013. NTT DOCOMO’s ARROWS X F-02E is the first smartphone to employ the ANT30 multi-mode modem from Access Network Technology. ANT is jointly owned by Fujitsu, NTT DOCOMO, NEC and Fujistu Semiconductor.

NXP Software and Tensilica have revealed today that NXP Software’s LifeVibes VoiceExperience is now available and optimized for Tensilica’s HiFi Audio/Voice DSP family. LifeVibes VoiceExperience offers a rich set of proven voice enhancements for clear, natural calling. Tensilica’s HiFi DSP family is the most widely-used licensable audio/voice DSP family, with support for over 100 proven audio/voice software packages.

Tensilica and Acoustic Technologies are delivering HD voice to the mobile market and will demonstrate their solutions for smartphones, tablets and mobile computing at booth 6-D101 at the Mobile World Congress in Barcelona from February 25 - 28.

Tensilica Inc today introduced IVP, an imaging and video dataplane processor (DPU) that is ideal for the complex image/video signal processing functions in mobile handsets, tablets, digital television (DTV), automotive, video game and computer vision based applications. The IVP DPU is a much needed breakthrough product in terms of energy efficiency and performance in current products and to enable applications never before possible in a programm...

Tensilica and Dream Chip Technologies announce that they are partnering to port and optimize DCT's video and image signal processing software to Tensilica's new IVP imaging digital signal processor. DCT has been a Tensilica Xtensions partner for a couple of years and will help support new joint customers with their extensive imaging, video and Xtensa DPU background.

Tensilica and Almalence announce that they are partnering to port and optimize Almalence's software for digital image processing to Tensilica's new IVP imaging/video digital signal processor. Almalence has joined Tensilica's Xtensions partner program and will help support new joint customers with their extensive imaging background.

TU Dresden, a leading German university in the field of electrical engineering, today announced the successful initial operation of a low-power test-chip featuring a Tensilica Xtensa LX4 DSP equipped with RacyICs power management IP implemented in GLOBALFOUNDRIES’ advanced 28nm Super Low Power technology.

Tensilica today introduced the HiFi Mini DSP core, the smallest, lowest power DSP IP core supporting always listening voice trigger and speech command modes. Optimized specifically for the smallest area and lowest power in smartphones, tablets, appliances, and automotive applications, the HiFi Mini DSP IP core enables a hands-free experience.

Tensilica has revealed today that 200 companies have licensed Tensilica’s dataplane processor unit technology. Over 500 licenses have been signed with these 200 companies, and several thousand unique DPUs have been optimized by Tensilica (standard products) and its licensees (customized products) and deployed in silicon.

Tensilica has revealed today that its licensees have recorded shipments of over two billion Tensilica dataplane processor units. Tensilica’s licensees are now shipping at a run rate of approximately 800 million Tensilica DPU IP cores per year, which is more than a 50 percent increase over the run rate announced in June 2011, when the company reached its one billionth core shipment.

Tensilica is using the Tensilica HiFi Audio/Voice DSP to do all of the audio decoding and post processing in its new SOCs for DTV. Tensilica’s HiFi Audio/Voice DSP is the most popular audio IP core on the market, with the lowest power and largest library of over 100 ported software codecs.

Tensilica have today revealed that Renesas Electronics has signed a corporate-wide license for Tensilica's HiFi Audio/Voice digital signal processor. Renesas will use the HiFi DSP in a wide variety of system on chips for mobile handsets, tablets, automotive, and other multimedia devices.

Today Tensilica announced that Novatek is in volume production with three new home entertainment system-on-chip designs that use Tensilica's HiFi Audio digital signal processor for a high-fidelity audio listening experience. These new chips will be used in digital televisions and set-top boxes.

Tensilica today announced that Inband Software has worked closely with Tensilica on several HiFi Audio/Voice DSP porting projects and is now an Authorized Software Partner in the Xtensions Network. Inband Software can assist in algorithm development, fixed-point conversion, and optimization for Tensilica's HiFi Audio/Voice DSPs and other architectures.