This progress is set to empower shared clients to harness the benefits of 3D integrated circuit (3D-IC) designs with enhanced speed, efficiency in space utilisation, and energy consumption.
The collaboration has recently resulted in the certification of Siemens’ latest Solido SPICE, a component of the Solido Simulation Suite, for Intel's 16 and 18A nodes. The Solido Simulation Suite is an advanced collection of AI-enhanced simulators for intelligent integrated circuit (IC) design and verification, offering comprehensive circuit verification for a wide array of designs including analogue, mixed-signal, RF, memory, library IP, 3D-IC, and System-on-Chip (SoC).
Intel’s 18A node marks a significant step forward in the foundry's process technology strategy. It features the cutting-edge RibbonFET gate-all-around (GAA) transistor architecture and PowerVia backside power delivery technologies, optimising density and performance for next-generation products. Targeting high growth areas such as High-Performance Computing (HPC), mobile, and other rapidly expanding sectors, Intel 18A and Intel 16 now also support the Open Model Interface (OMI), an industry-standard platform facilitated by Siemens’ Solido Simulation Suite for ageing modelling and reliability analyses.
“Siemens is committed to collaborating with Intel Foundry to provide our mutual customers with the most advanced technologies possible to leverage when designing highly complex ICs and advanced packaging,” said Amit Gupta, Vice President and General Manager, Custom IC Verification, Siemens Digital Industries Software. “The certification of Solido SPICE and the availability of the EMIB reference flow for early customers by Intel reinforce our joint commitment to providing mutual customers with highly accurate, next-generation tools that enable innovation required to differentiate and win in highly competitive markets.”
In addition, Siemens announced the release of the EMIB reference flow, designed to assist early users of Intel Foundry’s EMIB technology. This in-package, high-density interconnection of heterogeneous chips approach is supported by an Intel Foundry developed Package Assembly Design Kit (PADK), allowing customers to navigate essential design and tape-out processes effectively. Siemens' Calibre nmPlatform will validate the EMIB silicon layouts for DRC, LVS, and 3D Thermal analysis.
Clients can also engage in comprehensive package and substrate system planning, design, and verification using Siemens’ Xpedition Substrate Integrator, Xpedition Package Designer, Hyperlynx SI/PI, and Calibre 3DSTACK software. These tools are part of Siemens' industry-leading IC and semiconductor packaging portfolios, which offer detailed package assembly prototyping and predictive multi-physics analysis.
“Intel Foundry is revitalising the semiconductor industry with new fabrication and highly innovative advanced packaging technologies targeted at taking modern day electronics to entirely new levels. Our collaboration with Siemens for precise EDA enablement is key to nurturing the growing ecosystem,” commented Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. “The recent certification of Siemens’ newly released Solido SPICE, part of Solido Simulation Suite,to run seamlessly on our advanced process technologies underscores the success we’ve seen in our ongoing close collaboration with Siemens. And by developing a certified, production ready EMIB technology reference flow, Intel Foundry and Siemens EDA have delivered yet another major milestone, empowering IC design companies to boldly innovate complex ICs for any electronic application.”
