Siemens Digital Industries Software announced that it has completed the acquisition of DownStream Technologies. This acquisition strengthens Siemens’ PCB design portfolio and expands its footprint in the electronics small and medium-sized business (SMB) market. 

Siemens has officially marked the opening of its $190 million electrical equipment manufacturing facility in Fort Worth, Texas with a celebratory ribbon cutting ceremony.

Siemens Digital Industries Software announces that it has expanded the cloud platforms of choice available for systems-of-systems development with its PAVE360 technology for software defined vehicle (SDV) development which is now available on AMD Radeon PRO V710 GPUs and AMD EPYC CPUs running on Azure, Microsoft’s Cloud and AI platform.

Siemens Digital Industries Software has announced, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using Siemens advanced packaging integration solutions.

Siemens Digital Industries Software recently announced it has signed an exclusive OEM agreement for its EDA business to bring Alphawave Semi's portfolio of high-speed interconnect silicon IP to market through its sales channel.

Siemens Digital Industries Software announced that RIKEN, a national research and development agency in Japan, is improving its resesrch on next-generation AI devices with Siemens' Veloce Strato CS emulation and Catapult High-Level Synthesis (HLS) platforms to conduct architecture and design space exploration of AI accelerator devices.

Siemens Digital Industries Software recently announced an extension of its Veloce hardware-assisted verification platform to support 1.6TBps Ethernet.

Siemens and Eplan will make engineering and production processes for customers in machine and line building more efficient. This will be achieved by both companies significantly expanding data interoperability between their offerings.

Siemens Digital Industries Software announces that its continued collaboration with longtime customer Samsung Foundry has established a host of new certifications for its recently introduced Solido SPICE software, which supports the verification of next-generation analog, mixed-signal, RF, memory, library IP, and 3D-IC semiconductor designs.

Siemens Digital Industries Software announced its ongoing collaboration with Infineon to combine Siemens embedded automotive software platform, based on the AUTOSAR Classic platform R20-11, with Infineon’s AURIX TC4x microcontroller.

Siemens EDA debuted its next generation AI-enhanced Electronic Systems Design software at electronica. Ed Goldman, Director of Program Management describes how it simplifies complex PCB design processes, reduces learning curves, and accelerates time-to-productivity.

Siemens Digital Industries Software recently announced the latest advancement in its electronic systems design portfolio: the next generation release takes an integrated and multidisciplinary approach, combining Xpedition software, Hyperlynx software and PADS Profesional software into a unified user experience.

Siemens Digital Industries Software introduced Tessent Inn-System Test software, a design-for-test (DFT) solution that enhances in-system test capabilities for integrated circuits (ICs).

Siemens is spending $10.8 billion to acquire software supplier Altair Engineering.

Siemens Digital Industries Software has announced that GlobalFoundries (GF) has certified Siemens' Analog FastSPICE (AFS) platform for its 22FDX, 22FDX+, 12LP, and 12LP+ Process Design Kits (PDKs). 

Siemens Digital Industries Software announces it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications, and innovative technology enablement for the foundry’s newest process technologies.

Siemens Digital Industries Software announces that Japan-based Preferred Networks (PFN), a pioneer in deep learning and artificial intelligence technology, has selected Siemens’ PowerPro software to optimise the power efficiency of its next-generation AI processors.

Siemens Digital Industries Software has announced that SiliconAuto has adopted its PAVE360 software to streamline the development of its advanced semiconductors for the automotive sector. 

Siemens Digital Industries Software has announced it has joined the Global Battery Alliance (GBA), a collaboration platform that brings together leading international organisations, NGOs, industry actors, academics and multiple governments to align collectively in a pre-competitive approach, to drive systemic change along the entire battery manufacturing value chain.

Siemens Digital Industries Software has introduced Tessent Hi-Res Chain software, a new tool designed to address the critical challenges faced by integrated circuit (IC) design and manufacturing teams in advanced technology nodes, where even minor process variations can significantly impact yield and time-to-market.