Siemens Digital Industries Software announced its ongoing collaboration with Infineon to combine Siemens embedded automotive software platform, based on the AUTOSAR Classic platform R20-11, with Infineon’s AURIX TC4x microcontroller.

Siemens EDA debuted its next generation AI-enhanced Electronic Systems Design software at electronica. Ed Goldman, Director of Program Management describes how it simplifies complex PCB design processes, reduces learning curves, and accelerates time-to-productivity.

Siemens Digital Industries Software recently announced the latest advancement in its electronic systems design portfolio: the next generation release takes an integrated and multidisciplinary approach, combining Xpedition software, Hyperlynx software and PADS Profesional software into a unified user experience.

Siemens Digital Industries Software introduced Tessent Inn-System Test software, a design-for-test (DFT) solution that enhances in-system test capabilities for integrated circuits (ICs).

Siemens is spending $10.8 billion to acquire software supplier Altair Engineering.

Siemens Digital Industries Software has announced that GlobalFoundries (GF) has certified Siemens' Analog FastSPICE (AFS) platform for its 22FDX, 22FDX+, 12LP, and 12LP+ Process Design Kits (PDKs). 

Siemens Digital Industries Software announces it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications, and innovative technology enablement for the foundry’s newest process technologies.

Siemens Digital Industries Software announces that Japan-based Preferred Networks (PFN), a pioneer in deep learning and artificial intelligence technology, has selected Siemens’ PowerPro software to optimise the power efficiency of its next-generation AI processors.

Siemens Digital Industries Software has announced that SiliconAuto has adopted its PAVE360 software to streamline the development of its advanced semiconductors for the automotive sector. 

Siemens Digital Industries Software has announced it has joined the Global Battery Alliance (GBA), a collaboration platform that brings together leading international organisations, NGOs, industry actors, academics and multiple governments to align collectively in a pre-competitive approach, to drive systemic change along the entire battery manufacturing value chain.

Siemens Digital Industries Software has introduced Tessent Hi-Res Chain software, a new tool designed to address the critical challenges faced by integrated circuit (IC) design and manufacturing teams in advanced technology nodes, where even minor process variations can significantly impact yield and time-to-market.

Siemens Digital Industries Software announced that Dovetail Electric Aviation, a sustainable aviation company, has chosen the Siemens Xcelerator software portfolio to design zero-emission battery and hydrogen-electric propulsion systems for commercial aircraft.

Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.

Siemens Digital Industries Software announces a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology.

Siemens Digital Industries Software announced that its continued partnership with Intel Foundry has led to the creation of a new Electronic Design Automation (EDA) product certification and an advance in embedded multi-die interconnect bridge (EMIB) technology. 

Siemens Digital Industries Software has introduced Calibre 3DThermal, innovative software for thermal analysis, verification, and debugging in 3D integrated circuits (3D-ICs).

Siemens Digital Industries Software has announced the release of the Solido Simulation Suite software ("Solido Sim" software), an integrated suite of AI-enhanced SPICE, Fast SPICE, and mixed-signal simulators. 

Siemens Digital Industries Software announced that, in collaboration with Samsung Foundry, it has developed new capabilities for manufacturing multi-die packaged designs at advanced nodes.

Siemens Digital Industries Software has announced two breakthrough capabilities for high-level verification of C++ for hardware design: formal property checking and reachability coverage analysis.

Siemens Digital Industries Software announced Catapult AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs).