Master Bond offers dual cure adhesive

It cures rapidly without oxygen inhibition upon exposure to 405 nm LED light, followed by a short 30-45 minute heat cure at 90-95°C, making it suitable for bonding heat sensitive components. LED415DC90Med passes ISO 10993-5 requirements for non-cytotoxicity and resists common medical sterilants, including glutaraldehyde, peracetic acid, ethylene oxide, and gamma radiation.

Unlike conventional dual cure adhesives that limit light penetration to approximately 1mm, LED415DC90Med can partially cure or fixture sections up to 6 mm deep when exposed to 405 nm LED light at the appropriate intensity and for a sufficient duration. This deeper cure capability allows the fixturing of opaque components by allowing light penetration through the adhesive from the sides. A subsequent cure at 90-100°C for 30-60 minutes is recommended to optimise strength and overall performance.

LED415DC90Med has a thixotropic index of 5.53 at room temperature. It exhibits a tensile strength of 5,500-6,500 psi, a tensile modulus of 450,000-550,000 psi, and a lap shear strength exceeding 1,000 psi (aluminum to aluminum). This rigid system cures to a Shore D hardness of 85-90 with an elongation of 1-3% at 75°F. It is serviceable from -80°F to +350°F, electrically non-conductive (volume resistivity > 10¹⁴ ohm-cm), and bonds well to a variety of substrates, including plastics, glass, and metals. LED415DC90Med is available in syringes, ½ pint, pint, and quart containers.