Master bond addition cured silicones

This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic, opto-electronic and specialty OEM industries.

This system has a thermal conductivity of 1.15-1.30 W/(m•K). It is highly flexible with a low tensile modulus of 500-700 psi, an elongation of 50-60%, and a hardness of 70-75 Shore A. This combination of properties enables it to withstand aggressive thermal cycling and mechanical shock. MasterSil 323AO-LO has a relatively high strength profile for a silicone with a tensile lap shear strength of 250-350 psi at room temperature. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, plastics, and other silicones without imparting residual stress when heat cured. Serviceability is from -65°F to +400°F [-54°C to +204°C].

MasterSil 323AO-LO features a paste-like consistency, which allows it to also be used as a gap filling material where minimum flow after application is desired. This formulation offers a variety of cure schedule options, with the optimum being overnight at room temperature followed by 3-5 hours at 125-175°F. It does not require exposure to air for complete cross-linking. MasterSil 323AO-LO has an easy to use 1:1 mix ratio and is available for purchase in standard containers or gun applicator kits making it convenient for manual or automated dispensing.