Indium to feature Durafuse solder technology

Among its featured products, Indium Corporation will showcase its lead-free Durafuse technology and Indium8.9HF solder paste series:

• Durafuse HR: based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (–40°C/125°C and –40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
• Award-winning Durafuse LT: a novel solder paste alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, assemblies with large temperature gradients, and large BGAs with large complex warpage profiles. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
• Indium8.9HF solder paste series: a solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.

Some of the additional Rel-ion and high-reliability products for power electronics featured at IPC APEX will include:

• Indalloy301 LT Alloy for Preforms/InFORMS: a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
• Award-winning InFORMS: reinforced solder alloy fabrications which improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. 
• InTACK: a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
• QuickSinter: a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput.
• Durafuse HT: a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys.
• Heat-Spring: a compressible, non-reflow metal TIM ideal for TIM2 applications.