Design

Electronic Specifier announces the release of a new technical article: ‘The impact of AI within electronic design: a contextualised analysis of current and future AI application in electronic design.’

Resolve Optics announce a new 6x Non-Browning Zoom Lens design optimised for a 1” sensor format shielded camera.

xMEMS Labs have unveiled its latest groundbreaking innovation: the xMEMS XMC-2400 µCooling chip. This is the industry’s first all-silicon, active micro-cooling fan, designed for ultramobile devices and next-generation artificial intelligence (AI) applications.  

SignatureIP, the pioneer of next generation interconnect and interface solutions, announces that its Networks-on-Chips (NoCs) provide the necessary infrastructure to efficiently connect and manage RISC-V CPUs in complex chip designs.

Laird Thermal Systems, the global manufacturer of thermal management solutions, will be exhibiting at the 2024 China International Optoelectronic Exhibition from 11–13 September 2024 at the Shenzhen World Exhibition and Convention Centre.

Master Bond EP21ARHTND-2 is a two-part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals.

As Team GB celebrates its achievements at the Paris 2024 Olympic Games, Renishaw has also marked a milestone by contributing its additive manufacturing (AM) expertise to the creation of a track bike for British Cycling.

Pulsiv has unveiled a 65W USB-C GaN optimised reference design, which claims to be among the world’s most efficient.

Sfera Labs believe in the power of open platforms to drive innovation in industrial applications.

Moore’s Law states that the number of transistors on a microchip doubles approximately every year, but how long will Moore’s Law last?