Design

SHENMAO is pleased to announce the launch of its latest innovation, the rosin-free no-clean liquid flux SM-ZR10, specifically designed for automatic wave soldering processes.

China has made headlines with its latest technological breakthrough in high-speed transportation: the T-Flight maglev train.

The reliability and performance of Electric Vehicle (EV) chargers are critical to drive global market adoption.

In a strategic initiative aimed at offering automakers innovative opportunities, Intel has introduced its first discrete graphics processing unit (dGPU), the Intel Arc Graphics for Automotive, at the AI Cockpit Innovation Experience event.

Versinetic announces the launch of EVerest integration, a modular and flexible software stack tailored for EV charging station manufacturers and operators.

Physicists at The Cavendish Laboratory have discovered two new methods that allow further enhancements of organic semiconductors.

The construction of a pioneering X-ray telescope has been successfully completed, marking a significant milestone in the study of solar winds and their interaction with Earth’s magnetosphere.

OKW has announced that its DATEC-POCKET-BOX can now accommodate N, AA, AAA and 9 V cells for a wide range of handheld electronics.

Three Fraunhofer Institutes have launched a forward-looking research initiative in Dresden: the Chiplet Center of Excellence (CCoE).

igus has developed an injection moulded bicycle frame made of recyclable composite material for the e-bike manufacturer Advanced Bikes.