Design

As the ABB FIA Formula E World Championship revs up for its 2024 season, the TAG Heuer Porsche Formula E Team is set to hit the track with LOCTITE. This secret ingredient from Henkel Adhesive Technologies plays a crucial role in enhancing the team’s electric race cars.

SEGGER has introduced support for Scalable Vector Graphics (SVG) in emWin, providing developers with a powerful and efficient solution for rendering scalable and rotatable graphics in embedded applications.

Disney’s Research and Development department, led by engineer and inventor Lanny Smoot, has introduced HoloTile, “the world’s first multi-person, omnidirectional, modular, expandable, treadmill floor.”

Inelco Hunter has announced the availability of the TechNexion range of Embedded Camera Modules.

Spectrum Control has introduced a family of modular power EMI filters bringing high performance and design flexibility to a variety of MIL-STD-461 designs with size, weight, power, and cost (SWaP-C) requirements.

AMD UltraScale+ FPGAs and AMD Versal adaptive SoC product families have become the industry’s first FPGA and adaptive SoC implementations to conform to the VESA DisplayPort 2.1 standard.

The ingenuity of nature has once more led to human innovation in fields of electronics and optics. At the forefront of this innovation is the implementation of moth eye-inspired coatings, a technological leap that promises to reshape various industries.

A team led by Professor Young S. Park from UNIST’s Department of Chemistry has made a groundbreaking advancement in the realm of organic semiconductors.

StenTech, global company specialising in SMT Printing Solutions, is delighted to announce the official launch of its new establishment in Clearwater, Florida.

Littelfuse, an industrial technology manufacturing company empowering a sustainable, connected, and safer world, is excited to announce the availability of the MITI-7L Reed Switch Series.