Design
New advanced materials centre of excellence
The Defence Science and Technology Laboratory (Dstl) has established a £42.5 million research partnership to pioneer new materials.
Solid Sands adds C++ headers to its SuperGuard Library Safety Qualification Suite
Solid Sands announced that it has added a collection of C++ headers to its SuperGuard Library Safety Qualification Suite.
NECTO Studio 6.0 enables developers to bring circuits to life
MikroElektronika (MIKROE) has unveiled v6.0 of NECTO Studio, the company's complete, cross-platform integrated development environment (IDE) for embedded applications.
Avnet release Avnet RFSoC Explorer Toolbox Version 3.0
Avnet has released the Avnet RFSoC Explorer Toolbox Version 3.0, which now includes support for over-the-air antenna to bits prototyping with the 5G mmWave Phased Array Antenna Module (PAAM) Development platform.
Anima unveils first AI code personalisation for developers
Anima has announced AI Code Personalisation that leverages generative AI in its code-generation engine.
What is the revolutionary integrated circuit design GreenPAK
GreenPAK, a Renesas Electronics' family of mixed-signal integrated circuits, signifies a breakthrough in configurable mixed-signal ICs (integrated circuits). This innovative technology combines analog and digital blocks that can be tailored through programmable non-volatile memory, a feature that sets it apart in the semiconductor industry.
ASMPT launches SMT Analytics
The new SMT Analytics software from ASMPT evaluates the SMT process in detail by identifying and locating problematic aspects that often go unnoticed and can lead to shortfalls in efficiency and performance. The innovative software helps employees to detect the causes of trouble, highlights potential losses, and points out potential improvements.
Chiplets are rising: where and when?
Yole Group is set to participate in the Chiplet Summit 2024, taking place from February 6-8th at the Santa Clara Convention Centre.
Keysight RFPro gets thumbs-up or Samsung 8-nm
Keysight Technologies says that the RFPro electromagnetic (EM) simulation software, part of its EDA Advanced Design System (ADS) integrated tool suite, is now certified by Samsung Foundry for design engineers targeting its 8-nanometer (nm) LPP (Low Power Plus) process.
Alpha and Omega Semiconductor announce cooling package
Alpha and Omega Semiconductor has announced the AONA66916, a 100V MOSFET packaged in a top and bottom side cooling DFN 5 x 6 package.