Design

SHENMAO Technology is pleased to offer its PF606-P276 ultra-low void no-clean zero-halogen lead-free solder paste.

Keysight recently held a webinar titled: “Overcoming Design Challenges in the Era of Wide Bandgap Semiconductors,” in which valuable insights on the trends and challenges of power electronics were explored.

PTC has unveiled the eleventh iteration of its Creo computer-aided design (CAD) software, along with the most recent update to its Creo+ SaaS CAD solution.

MathWorks has announced an integration that makes MATLAB available in the NVIDIA Holoscan platform.

The integration of artificial intelligence (AI) into aircraft design represents a transformative shift within the aerospace industry.

Synopsys has announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.

The National Composites Centre, part of the High Value Manufacturing Catapult, has released a case study detailing their successful delivery of the design and manufacture of vital one-off flying parts to facilitate UK capability towards accelerating new technologies to decarbonise the aviation industry.

CUI Devices’ Thermal Management Group announced the expansion of its line of BGA heat sinks.

Nordson Electronics Solutions, a global pioneer in electronics manufacturing technologies, has received the conformal coating equipment award from EM Asia China for the new ASYMTEK Select Coat SL-1040 conformal coating system, at an award ceremony during Productronica China, held 21st March 2024 in the Shanghai New International Expo Centre, Shanghai, China.

GOWIN Semiconductor Corporation, an FPGA manufacturer experiencing rapid growth, announced the certification of its GOWIN EDA FPGA design environment