Design

Peters has recently expanded its product range with the introduction of ELPECAST VU 4545/101, a casting compound distinguished by its remarkably high thermal conductivity. 

Here, you can find out the key factors to consider when implementing GaN in power electronics design processing, and the challenges of doing so.

Weller Tools, a specialist in hand soldering solutions, is proud to announce its participation in the upcoming SMTconnect exhibition, scheduled to take place from 11–13 June 2024 in Nuremberg, Germany.

Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.

Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on 16th May 2024 in Aurora, Colorado.

The world’s most advanced wind turbine test facility will be built in Blyth, Northumberland, as part of an £86m investment in wind power R&D facilities aimed at reducing CO2 emissions and boosting the economy, Science, Research and Innovation Minister, Andrew Griffith, announced.

Sphere Entertainment announces that it has acquired all of the remaining shares it did not previously own of HOLOPLOT, a global pioneer in 3D audio technology.

Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector.

Students in West Cumbria have been tasked by the Robotics and AI Collaboration (RAICo) and the Industrial Solutions Hub (iSH) to design and build robots which will be showcased at a major robotics and artificial intelligence (RAI) industry event.

In a significant stride for semiconductor technology, a team led by Professor Yong-Young Noh from the Department of Chemical Engineering at Pohang University of Science and Technology (POSTECH) has developed a new tellurium-selenium composite oxide semiconductor material.