Design
Navigating the RISC-V landscape: unveiling the Embeetle IDE
Embeetle was founded by three engineers with unique insights into embedded software IDEs. The Embeetle team is committed to building a healthy MCU ecosystem, offering convenience to manufacturers and developers. The Embeetle IDE addresses one of the main challenges in adopting RISC-V technology: the development environment.
TouchNetix introduces TactoSense button solution
TouchNetix has announced a new touch/force button-enabling solution, the TactoSense, utilising aXiom technology.
Imec demonstrates new die-to-wafer hybrid bonding
At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...
Major imaging challenges in microscopy and how to solve them
Microscopic cameras play a major role in medical applications for surgery, pathology, and diagnostics.
Weebit Nano and Efabless enable affordable SoC prototyping
Weebit Nano, a leading developer and licensor of advanced memory technologies for the global semiconductor industry, and Efabless, the creator platform for chips, announce their collaboration to enable fast and easy prototyping of intelligent devices using Weebit’s technology.
Effective cooling of hot spots with liquid-cooled heat sinks
Liquid-cooled heat sinks are used in applications where passive or fan-based cooling solutions are insufficient, but effective cooling is indispensable.
Building next gen chips for your next self driving car
The concept of a self-driving car has taken the world by storm. Here Simran Khokha, Product Manager at Infineon Technologies, delves into the crucial development of next-generation chips for self driving cars, detailing their reliance on advanced semiconductors and sensors to ensure enhanced performance, safety, and comfort across various levels of vehicle automation.
Wise-integration and Leadtrend launch GaN SiP
French-based company Wise-integration, together with Leadtrend Technology Corporation, a specialist in analogue and analogue-digital mixed-mode IC designs, has announced the release of a GaN system-in-package (SiP) for consumer electronics applications.
ROHM and Nanjing SemiDrive Technology develop smart reference design
ROHM and Nanjing SemiDrive Technology, one of China’s largest SoC manufacturers for smart cockpits, have jointly developed a smart cockpit reference design.
STMicroelectronics demo board boosts dual-motor designs
STMicroelectronics’ EVSPIN32G4-DUAL demonstration board controls two motors from a single STSPIN32G4 integrated driver, accelerating product development and simplifying the PCB design and bill of materials (BoM).