Design
MicroCare introduces Tergo cleaning fluids to precision cleaning fluid line
MicroCare LLC announces the expansion of its precision cleaning fluid line with the introduction of new Tergo vapour degreasing cleaning fluids.
Unveiling innovations at PCIM with MacDermid Alpha
MacDermid Alpha Electronics Solutions, one of the leaders in integrated technologies and materials for the electronics industry, is set to showcase advanced solutions for die, package, and top-side attach at PCIM Europe.
ASML and imec open joint High NA EUV Lithography Lab
Imec, a global research and innovation hub in nanoelectronics and digital technologies, and ASML, a pioneering lithography supplier to the semiconductor industry, have announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by ASML and imec.
Pasternack launches advanced RF fixed attenuators and terminations
Pasternack, an Infinite Electronics brand and a provider of RF, microwave, and millimeter-wave products, has announced its latest series of RF fixed attenuators and terminations, crafted to accommodate applications up to 18GHz.
DELO presents a new jet valve for ultra-small dispensing quantities
DELO has introduced a new microdispensing valve. The DELO-DOT PN5 LV pneumatic jet valve is designed for dispensing low-viscosity adhesives and other media in miniaturised applications.
LOCTITE 55 sees new packaging debut
LOCTITE 55 is now available in a new dispenser, featuring many new developments, thanks to valuable installer and plumber feedback.
New soldering and tinning pastes for soft soldering
Emil Otto is expanding its metal chemistry product portfolio for soft soldering with the introduction of ZINNIN Green soldering and tinning pastes.
Codasip RISC-V core for power-efficient applications
Codasip has introduced a new low-power embedded processor core, and the next generation of processor design automation toolset Codasip Studio.
Laird Thermal Systems launches the SuperCool X series
Laird Thermal Systems has launched a new high-performance thermoelectric cooler assembly series that utilises next-generation thermoelectric coolers with advanced semiconductor materials.
Raspberry Pi releases new AI kit
The Raspberry Pi Foundation, in collaboration with Hailo, announces the release of the Raspberry Pi AI Kit.