Design

dSPACE, one of the world's leading solution providers for simulation and validation of automated and connected vehicles, and an Amazon Web Service (AWS) Automotive Competency Partner, is developing an advanced scenario generation solution by leveraging generative AI technologies from Amazon Web Services (AWS).

Amphenol distributor Inelco Hunter has announced the release of the Small Thread Adaptor (STA) Option for the Sine Systems DuraMate product line. 

Alphawave Semi has unveiled a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform.

KYOCERA AVX, a global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has launched the new 9169-000 Series single-piece wire-to-board card-edge connectors.

Wave Photonics, a deep tech startup based in Cambridge, secured £4.5M to advance on-chip photonics designs for quantum technologies, sensors, and data centre applications.

At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence Tensilica Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence Verification solution and full-flow digital implementation, including signoff.

NVIDIA researchers are at the forefront of the rapidly advancing field of visual generative AI, developing new techniques to create and interpret images, videos, and 3D environments.

Lumus has announced a strategic partnership with AddOptics, a provider of advanced prescription lens solutions, to enhance immersive AR glasses experiences globally.

The SCHURTER OGN fuseholder is a classic that has been continuously improved and expanded with new variants. The THT variant was followed by one for SMT assembly.

Master Bond UV15DC80-1Med presents a unique dual-cure mechanism, combining UV light for initial setting with heat for full polymerisation.