Design
Siemens introduces Innovator3D IC
Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.
Siemens debuts advanced ESD verification for IC design
Siemens Digital Industries Software announces a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology.
Siemens and Intel's partnership bears fruits
Siemens Digital Industries Software announced that its continued partnership with Intel Foundry has led to the creation of a new Electronic Design Automation (EDA) product certification and an advance in embedded multi-die interconnect bridge (EMIB) technology.
SignatureIP announces early access to Cloud-based NoC design tool
SignatureIP has announced the early access release of its Cloud-based iNoCulator NoC design tool.
High performance and enhanced reliability for advanced packages
MacDermid Alpha Electronics Solutions unveils the MICROFAB SC-40 PLUS. This next-generation, high-purity, high-speed copper plating process is engineered for semiconductor production.
Siemens advances 3D-IC adoption with Calibre 3DThermal
Siemens Digital Industries Software has introduced Calibre 3DThermal, innovative software for thermal analysis, verification, and debugging in 3D integrated circuits (3D-ICs).
Baya Systems takes wraps off IP for chiplet design
Start-up Baya Systems has emerged from stealth mode to announce its software-driven IP technology portfolio designed to accelerate complex single-die and multi-die SoC designs.
PhysicsX wants to give engineers AI superpowers
PhysicsX is integrating artificial intelligence (AI) and simulation engineering to transform the design and operation of machines and products in various advanced industries.
HARTING and Altium collaborate on 3D circuits design
The relentless trend of miniaturisation in electronics continues to challenge engineers to incorporate increasing functionality into progressively smaller devices.
dSPACE and AWS to drive innovation in autonomous driving with Gen AI
dSPACE, one of the world's leading solution providers for simulation and validation of automated and connected vehicles, and an Amazon Web Service (AWS) Automotive Competency Partner, is developing an advanced scenario generation solution by leveraging generative AI technologies from Amazon Web Services (AWS).