Thermally conductive compound for high-end electronics

The end result is a thermal compound that efficiently dissipates heat to improve performance and reliability of high sensitive server processors. The TC-5888 thermal compound also features what the company says are unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces – such as in between large server packages and corresponding heat sinks. TC-5888 Thermally Conductive Compound also offers low volatile content vs. competitive thermal compounds, allowing for more consistent rheology, application repeatability and easier screen printing overall.