Thermal compound provides excellent vibration absorption
Among the industry's highest performance form-in-place gap filler compounds, SARCON SPG-50A from Fujipoly is a 5.0 W/m°K silicone based material suited for electronic devices that have delicate components or ultra-low compression force requirements.
The form stable SPG-50A material fills large gaps around fragile circuit board solder points without causing damage or loss in performance. This facilitates efficient transfer of heat from any board-level source to a nearby heat sink or heat spreader.
Due to its unique composition, this thermal compound provides excellent vibration absorption capabilities and maintains all initial properties across a wide temperature range from -40 to +150°C. SARCON SPG-50A is available in easy-to-use tubes or syringes.
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