Component Management
Seminar will focus on solder joint reliability
Indium Corporation is to partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan Hsinchu.
Technical experts from both companies will detail high-reliability technology and materials for automorive electronics applications, including:
- High-reliability alloys and low-tempurature solders
- Reliable materials for SiP applications
- Power semiconductor developments and applications in the automotive market
- Vacuum oven reflow technology and applications
For registration details, contact Tommy at tfan@indium.com.