Photoresist for MEMS and wafer-level packaging
Engineered Material Systems has introduced the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
DF-3520 is available in other thickness formats from 5 to 50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.
The DF-3520 film is tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 154°C (by DMA Tan Delta) and a moderate modulus of 3.25 GPa at 25°C. It is hydrophobic in nature, providing chemical and moisture resistance. DF-3520 is compatible with and can be used in contact with the EMS line of spin-coatable photoresists.
DF-3520 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
