Global supplier of conductive interconnect materials, Engineered Material Systems, will exhibit in Hall C1, booth 354 at the Intersolar Europa Solar Power Expo, scheduled to take place May 15th to 17th, 2019 in Munich, Germany. Company representatives will show next-generation low-cost electrically conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules.

Global supplier of electronic materials, Engineered Material Systems, for circuit assembly applications, has debuted its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.

Engineered Material Systems has announced plans to exhibit at the SNEC PV Power Expo, scheduled to take place 28th-30th May, 2018 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W3, Booth 806.

Engineered Material Systems has introduced its 631-39 UV plus thermal cured adhesive for bonding lens holders in camera module applications. It is designed to adhere to engineered plastics used in lens holder assemblies. These materials are engineered to withstand circuit board reliability test criteria.

Engineered Material Systems has announced the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.

Engineered Material Systems will exhibit its durable conductive inks, insulators and SMT adhesives in Booth #1222 at the IPC APEX EXPO, scheduled to take place Feb 14-16th in San Diego, CA. Durable inks and adhesives work well on traditional polyester film but also on pliable or stretchable substrates like thermoplastic urethane (TPU) or with ink heat-transfer systems. CI-1036 silver ink offers superior durability on PET film or TPU films.

Engineered Materials Systems has announced a fast cure conductive adhesive for die attach applications with small to medium size die. Called EMS 561-338, it is designed to cure in less than one minute at 150ºC.

Engineered Material Systems has introduced the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems has introduced its EMS 561-676 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-676 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.

Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America (July 12-14) in San Francisco. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.

Engineered Material Systems (EMS) is to exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.

Engineered Materials Systems has announced its new EMS 618-116 Adhesive, a low-temperature cure one-part conductive adhesive designed for circuit assembly applications. EMS 618-116 is designed to cure in 30 minutes at 100°C or rapidly at elevated temperatures.    

Engineered Material Systems, Inc has introduced the DF-3010 dry film negative photoresist optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc. will exhibit its DF-1000 Series Negative Film Photoresists at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City. 

  Engineered Materials Systems (EMS) has announced that it will showcase its DF-3000 series negative film photoresists during SEMI MEMS 2015, 17th to 18th September 2015 at the AtaHotel in Milan, Italy.

Engineered Material Systems (EMS) will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place 15th to 17th September, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.

Engineered Material Systems has introduced the DF-3050 Dry-film Negative Photoresist for use in MEMS and wafer-level packaging applications (TSV sealing). This material formulation has been optimised for hot roll lamination and processing on MEMS and IC wafers.

Designed to electrically interconnect solar cells using ribbons, the EMS 561-403 low-cost snap cure conductive adhesive has been unveiled by Engineered Materials Systems. The adhesive is stress absorbing to withstand the rigours of thermal cycling and features excellent conductive stability to cell and ribbon metallisation during damp heat exposure.

Engineered Material System is pleased to introduce the DF-3005 Dry Film Negative Photo Resist for use in micro-electromechanical systems (MEMS) and wafer level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

  The introduction of the EMS 618-15 adhesive has been annouced by Engineered Materials Systems. The room temperature cure, two-part, conductive adhesive has been designed for circuit assembly applications.