Component Management
Non-conductive paste designed for flip chip packaging
Designed specifically to provide high reliability to the gold stud bump interconnects used in flip chip packaging, the 585-1 Non-Conductive Paste (NCP) has been introduced by Engineered Material Systems.
The 585-1 NCP features very high fracture toughness, adhesion, is ionically clan and cures in seconds during thermal compression bonding at 200°C. This NCP is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive, printed electronic and photonic applications.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
