Multi Vacuum in-line soldering system

The size of the PCB assemblies processed can measure to a maximum of 1000 x 450 x 60mm (L x W x H).

In the lead-free process, the vacuum treatment during the reflow phase ensures void-free solder joints. Thanks to the benefits of the advanced Asscon vapor-phase soldering technology, combined with Asscon's patented Multi Vacuum treatment of the PCB assembly before and after the soldering process, the void-free quality level achieved is unsurpassed to date. The system is also impressive due to its strikingly reduced energy consumption of 60 % (on average 3.5 kW/hour) and the correspondingly minimized operating costs, as well as the notably high operational reliability and user simplicity.

Besides the void-free solder joints achieved by the multi-vacuum treatment of the PCB assemblies after the reflow, the vapor-phase in-line soldering equipment excels with even more advantages and features. Among these is the oxidation-free soldering process without the use of costly nitrogen in the oxygen-free vapor-phase area, the precise adjustment of temperature gradients during the entire heat-up, the absolutely secure prevention of over-heating or damage to the PCB assemblies, no shadowing whatsoever by components, the uniform heating across the entire assembly, as well as the precisely reproducible temperature profile even with very diverse board designs.

Furthermore, the heating-up phase is remarkably short, and the machine features a user-friendly micro-processor controller system, an ingenious system for control and malfunction monitoring (with optical process control), and finally clear and unobstructed access for maintenance and service activities. The highest possible process reliability is ensured by the functionality of TGC (temperature-gradient control) throughout the soldering process and by ASB (automatic solder break) at the end of successfully applied soldering.