ASSCON Systemtechnik-Elektronik is set to showcase three new vapor phase soldering systems at this year’s productronica in Munich.

With regards to PCB soldering, electronic manufacturers often have the choice between reflow soldering and vapor phase soldering. Taking the significant increase in energy costs in the future into consideration, Asscon is focusing on the significant energy saving potential of its inline vacuum Vapor-Phase Soldering Systems at productronica 2019 in Munich (November 12-15).

ASSCON Systemtechnik Elektronik GmbH has a new partner for its business in Austria: Stepan GmbH. From now on, Stepan will provide sales, service, and support for the ASSCON portfolio of soldering solutions from its HQ in Vienna. The main contact for Austrian customers is Mr. Stefan Kessler, one of Stepan’s general managers and a long-time, experienced SMT expert. “I’m sure that in Stepan we have found a strong business partner i...

ASSCON Systemtechnik Elektronik has expanded its capabilities for precise analysis with a flexible and compact X-ray system for 2D and 3D micro-focus AXI (automated X-ray inspection). ASSCON’s Technology and Demo Center, located in Königsbrunn in the metropolitan region of Munich/Augsburg, now has a potent YXLON Y.Cougar system in full operation.

ASSCON Systemtechnik Elektronik GmbH has now become a member of the German Research Association 3-D MID e.V. The association consists of some 100 members from universities, R&D institutes and industrial companies. Founded in 1992 in the German city of Erlangen for the introduction and advancement of the MID technology, the association is dedicated to the support of the multifaceted and interdisciplinary performance requirements of this s...

At this years SMT/Hybrid/Packaging, Asscon will present its latest range of vacuum soldering systems including the models VP800 vacuum, VP6000 and VP7000. The highlight will be the new VP7000 multi-vacuum in-line soldering system featuring dual lane transport.

Asscon Systemtechnik-Elektronik GmbH will be launching its multi-vacuum in-line soldering system, the VP7000, at productronica. It is designed for the void-free large-scale production of highly complex PCB assemblies, including sophisticated 3D-MID configurations, for continuous operation (24/7) with void rate below 1% and can also be used for small series manufacturing with the highest quality requirements.

ASSCON will use its space, booth 339, hall 7, at SMT Hybrid Packaging, 5th to 7th May 2015, Nurnberg, to present its Dynamic Profiling Plus automatic temperature profiling and active control system, an extension of the previous Dynamic Profiling system, which ensures process safety in serial operation.