Measuring system provides automatic temperature profiling & active control

The Dynamic Profiling control system permits real time measuring of every soldering process on product level and the automatic creation and control of the soldering profile. Measuring standards are used, which are heated in the system together with soldering product. The temperature and heating behaviour of the product can thus be ascertained and recorded with no risk of destruction.

The measuring standard behaviour is used as a variable for active profile control during the soldering process. Dynamic Profiling Plus provides all prerequisites that the soldering system sets fully automatic to the soldering profile, given from the operator and a reference measurement. Elaborate manual settings and adjustments of the soldering profile from the operator have become a thing of the past. Even in vapour phase vacuum soldering systems, this innovative technology can substantially facilitate the daily work in the production.

Furthermore, the costs of production are substantially reduced and expensive test measurements are dropped. The purchasing and the storage of test assemblies can be also reduced to a minimum - a further contribution to avoid unnecessary expenses. The automatic and continuous monitoring of each soldering profile in real time ensures a reliable and constant high soldering quality (100% First Pass Yield) for production of efficient and long lasting products.

Claus Zabel, Managing Director, ASSCON, said: “Dynamic Profiling PLUS is an excellent tool for prototyping and benchmarking. It assists the user for fast and efficient access for new customers, products and markets. Since an immediate switch of the line at product change is possible, a result for the user is maximum flexibility and operation time (up time) in the electronic production, lower total cost and therefore a higher competitive position.”

For the vapour phase soldering process, Dynamic Profiling PLUS provides an important component to minimise the production preparation, while the internal measuring system for creating and monitoring the soldering profiles configures itself and optimises the measured temperature behaviour of the assembly. It is self-evident that the data recorded via Dynamic Profiling PLUS can be saved in databases for backup and traceability. Dynamic Profiling PLUS is therefore an important step for the vapour phase process up to Industry 4.0.