Low-Voiding solder pastes featured at IPC APEX 2016
Indium Corp says manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs and will help customers Avoid the VoiD with its void-reducing no-clean solder pastes at IPC APEX Expo.
Indium Corp has specifically formulated Indium10.1 and Indium8.9HF solder pastes to reduce voiding significantly below the industry average for improved finished goods reliability. Halogen-free Indium8.9HF solder paste has a unique oxidation barrier technology that makes it perfectly suited for a variety of applications, especially automotive assembly.
In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill. Indium10.1 and Indium8.9HF are part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
