Indium to Present at IEMT–EMAP 2016

Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will deliver the keynote address, The Future of Power Device Packaging: Materials and Assembly Processes.

Dr. Ning-Cheng Lee, Vice President of Technology, will lead a short course. Achieving High Reliability for Lead-Free Solder Joints will explore the detailed material considerations required for achieving high reliability in lead-free solder joints. Topics will include understanding the factors related to various failure modes and how to select proper solder alloys and surface finishes.

Sze Pei Lim, Semiconductor Product Manager – Asia, will present No-Clean Materials for Advanced Packaging Assembly, which details how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the flip-chip, as well as in system-in-package (SiP) assembly processes. Ultra-low residue no-clean fluxes help to Avoid the Void by reducing the flux residue left behind after soldering, thereby decreasing the danger of delamination.