Heat curable laminate material targets structural-bonding

This design effectively absorbs mechanical stresses induced by assembly-level CTE mismatch, or by shock and vibration. Two thickness grades give designers a choice of 0.254 or 0.305mm for structurally adhering discrete semiconductors such as power components, or PCBs, to a heat sink.

A choice of assembly techniques permits assemblers to achieve high thermal conductivity after lamination at constant pressure of 75psi or by using initial pressure only lamination. A test assembly using a TO-220 power package has demonstrated thermal impedance of 2.3°C/W after IPO lamination. Bond-Ply LMS-HD ensures very low interfacial thermal resistance, which helps maximise heat transfer.

This convenient and effective thermal-management solution also has very high dielectric strength, resulting in excellent electrical insulation properties and breakdown voltage of up to 5000V. The material is rated for continuous use over the temperature range from -60 to 180°C, and has a shelf life of up to five months, stored between 5 and 25°C.