Designed for structural-bonding applications requiring high thermal performance with absorption of mechanical stresses, the Bond-Ply LMS-HD has been released by Bergquist. The laminate material consists of a thermally conductive low-modulus silicone compound coated on a cured core and double lined with protective films.

  The Bond-Ply 800, a thermally conductive pressure-sensitive adhesive tape, which cures in ambient temperatures to allow fast and efficient assembly without the need for mechanical fasteners or high-temperature curing, has been released by Bergquist.  

Featuring a tough polyimide carrier to fulfil demanding automotive and industrial applications, the high-durability Gap Pad 1000HD thermal material has been introduced by Bergquist. The polyimide carrier maximises puncture and tear resistance and enhances handling characteristics, while also ensuring high dielectric breakdown voltage of over 10,000V.

The first in a line of low-volatility dispensable thermal interface materials, Bergquist has introduced Gap Filler 1500LV. The two-component liquid dispensable thermal interface material is optimised for applications such as LED lighting where designers need to minimise fogging of lenses or optics.

The company’s latest and highest performing dispensable thermal interface material, the Gap Filler 4000 has been announced by Bergquist. Enabling greater flexibility in dispensing and assembly processes, Bergquist claim that this delivers best-in-class thermal conductivity of 4.0W/m-K and extended working time of up to four hours.

The rapid growth of general LED lighting and the adoption of high-power automotive electronics like EPS and hybrid/electric drives are two megatrends challenging engineers to improve thermal management around hardworking components such as LED emitters and power semiconductors. By Michael Stoll, Product Manager, T-Clad, Bergquist.

The Bergquist Company has added Gap Pad VO Ultimate to its Gap Pad VO range of highly conformable thermal interface materials, providing higher thermal conductivity of 1.3W/m-K for customers needing the most efficient thermal management for optimum system reliability.

Optimised for high-power LED lighting and other applications requiring enhanced heat-transfer efficiency, Bergquist’s new HPL dielectric for Thermal-Clad substrates enables lower operating temperatures, higher LED driving currents, and reduced component count leading to simplified design and assembly.

Phase-change thermal materials could hardly be easier to use, but The Bergquist Company has further increased convenience and speed by introducing Hi-Flow 330P featuring one dry side and one naturally tacky side enabling efficient handling and dispensing. The new material delivers high thermal performance in addition to productivity benefits, achieving thermal impedance of only 0.17ºC-in2/W at 50 psi.

Bergquist has extended its family of S-class low-modulus gap pad materials optimised for high thermal performance by introducing Gap Pad 1500S30, which achieves thermal conductivity 1.3W/m-K and bulk-hardness rating 30 (Shore 00). The new formulation increases choice for designers seeking efficient heat removal from fragile components in cost-sensitive applications.

Bergquist has introduced its T-CLAD Metal-Core PCB circuits pre-applied with Bond-Ply 450 adhesive tape. The reflow-resistant thermal interface tape saves product manufacturers from manually applying thermal interface material after assembly. This streamlines production, allowing to quickly bond the MetalCore PCB to a heatsink avoiding laborious attachment of individual screws or clips.

The Bergquist Company announced it is launching its 5-wire resistive touch screens onto the European market, following last year’s successful introduction of these products to the American market. These touch screens are available in a wide range of sizes and aspect ratios; a variety of shielding options can be applied to them, such as EMI, RFI and ESD.

The Bergquist Company has extended its Gap Pad S-Class range of thermally conductive gap-filling products with the announcement of Gap Pad 5000S35. The new material provides an industry-leading combination of specifications, including thermal conductivity, softness, robustness and ease-of-use, for demanding applications such as cooling laptop CPUs, graphics processors and cards, CD-ROM drives, and voltage regulators.