End-to-end silicone solutions for 5G ecosystem showcased

As part of its exhibit, the company will debuted new products, highlighted existing products, and featured interactive displays that explain its end-to-end solutions for 5G-enabled consumer devices and technologies (smartphones, PCs, wearable devices, and advanced driver assistance systems (ADAS), telecommunications infrastructure (base stations, optical communications, core networks), and cloud computing & data centers (servers, high performance computing chips, and other datacom devices and equipment).

“Dow offers one of the world’s broadest and most robust portfolios of silicones and silicone-based solutions for the 5G ecosystem,” said Grace Zhang, Global Strategic Marketer for Consumer Electronics at Dow. “With the rapid deployment of 5G networks, demand for these technologies is soaring. Dow is committed to providing our customers with the top of the line solutions they need for protecting and enhancing 5G electronics.”

Dow supplies thermal management materials that efficiently dissipate the greater amount of heat associated with the higher power densities in 5G-enabled consumer devices and technologies, 5G telecommunications infrastructure, and cloud computing & data centers. These advanced silicones include thermal greases, gels, adhesives, and encapsulants. In addition to thermal management materials, Dow supplies silicone technologies that protect sensitive electronics from EMI, disturbances that can lead to malfunctions, data loss, and device failure. 

In electronics assembly, Dow’s silicone adhesives, sealants, conformal coatings and encapsulants deliver flexible protection against environmental contamination, vibration, and thermal stress. In component molding, Dow’s liquid silicone rubber (LSR) grades provide a range of performance properties, aesthetics, and processing options. These include non-post-cure LSR, self-lubricating LSR, fluorosilicone LSR, and optically clear LSR.  

Dow’s growing portfolio of silicone solutions for the 5G ecosystem includes technologies that have won the Edison Award, BIG INNOVATION Awards, Sustainability Award and R&D 100 Awards. At Productronica China 2021, Dow will spotlight important materials that address the needs of electronic industry manufacturers for next-generation materials that can meet the growing demands of the 5G ecosystem, especially thermal management.

These include new DOWSIL TC-5550 High Reliable Thermal Grease, a pump-out resistance solution developed for bare die applications; DOWSIL TC-4083 Dispensable Thermal Pad, a product that combines long-term thermal stability with efficient gap filling and room temperature curing; and DOWSIL TC-3065 Thermal Gel, a material that can replace fabricated thermal pads and provides no oil bleeding issue and low levels of volatile organic compounds (VOCs).