Dk of 3.51 suits ultrathin dielectric applications

11th May 2015

Isola Group

Barney Scott

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Datasheet

Isola has expanded its portfolio of halogen-free laminates and prepregs for high-end mobile applications with IS350MD, which slots into the range between Isola’s well-established standard Dielectric constant (Dk) material, DE156, and the company’s ultralow Dk material, IS300MD, which was introduced in 2014 and quickly gained momentum in the High Density Interconnect (HDI) market.

The demand for faster processing and more efficient designs in smartphones and tablets is driving the need for thinner, more powerful PCBs. These thin PCBs require low-Dk laminate materials to meet the impedance requirements of these advanced designs. IS350MD, with a Dk of 3.51, was engineered specifically for these types of ultrathin dielectric applications.

IS350MD is an FR-4 type base material with a resin matrix; it is based on a modified epoxy resin reinforced with conventional E-glass fabric. The requirements of flammability class V-0 per UL-94 are met without the addition of antimony compounds. As the IS350MD material does not contain halogens, it displays greater thermal stability than a standard FR-4, as demonstrated in its Time to Delamination (T288) measurements. IS350MD is engineered for ease of manufacturing. IS350MD laminate and prepreg can be tailored to any thickness to meet the needs of the latest multilayer HDI buildup technologies. It requires a short press cycle and, similar to FR-4 materials, it does not require plasma for desmearing, making it suitable for HDI mobile applications, while providing a competitive TCO.

Tarun Amla, Executive Vice President and CTO, Isola, stated: “With the introduction of IS350MD, Isola now has the broadest Dk offering for HDI applications. From DE156 with a Dk of 4.00 to IS350MD’s Dk of 3.51 to IS300MD’s Dk of 3.06, designers now have a wide selection of halogen-free materials to optimise their PCB designs.”