Conformable TIM offers thermal conductivity of 11 W/m°K
The introduction of a 1.0 mm thick sheet signals an expansion of Fujipoly’s Sarcon XR-Pe product offering. Conforming to most CPU and semiconductor shapes, the material offers thermal conductivity of 11 W/m°K (ASTM D 5470) with a thermal resistance as low as .06°Cin2/W.
Soft-touch characteristic is maintained for applications that require material compression from 30% up to 90%. The material can be used in applications with temperatures ranging from -40 to +150°C,with the advanced material helping to improve semiconductor performance by efficiently transferring unwanted heat to a nearby heat sink.
Sarcon XR-Pe is now available in 1.0, 1.5 and 1.5mm thick sheets up to a maximum dimension of 300mm x 200mm. This material can also be ordered in die-cut form to fit your custom application specifications.
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