Component Management
Conductive adhesive for small to medium size chip bonding
Engineered Materials Systems has announced a fast cure conductive adhesive for die attach applications with small to medium size die. Called EMS 561-338, it is designed to cure in less than one minute at 150ºC.
The adhesive is stress-absorbing to withstand the rigors of thermal cycling and is said to feature excellent conductive stability. The material can be applied by stencil printing or needle dispensing.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
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