Component Management

Offering precise placement of all SMD components from 01005 up to large and complex components on a single machine, the Paraquda2 has been announced by Essemtec. This system provides an unmatched combination of minimal programming effort and, equipped with two high-speed placement axes, it is able to place up to 10,500cph.

Offering double the capacity and throughput of its predecessor in just 16% more floor space, the FlexTRAK-CDS plasma system has been announced by Nordson MARCH. This high-volume, compact platform with strip processing capabilities is designed for plasma treatment prior to die attach, wire bond, mold encapsulation and underfill.

The CTSX magnetic field sensor family, from Crocus Technology, has completed qualification. Crocus announced the qualification alongside their manufacturing partner, TowerJazz, with the sensor product family ready for shipping for selected customers. The CTSX magnetic sensor product family includes CTSX100, 200 and 300 series. 

  Formulated for disk drive, camera module, optoelectronic and circuit assembly applications, Engineered Material Systems has announced the 535-10M-49 UV cured epoxy adhesive. The material contains a secondary thermal cure initiator that cures as low as 110°C for shadowed areas.

Providing reliable transmission of electrical signals, the anisotropic conductive DELOMONOPOX AC245 adhesive has been introduced by DELO Industrial Adhesives. Suitable for the reliable bonding of RFID chips and antennas, it offers high long-term die shear strength and enables efficient production as it can be jetted.

Based on a copper-manganese alloy, Noventin is the latest high-precision resistance alloy from Isabellenhütte. Featuring a resistivity of 90µΩcm, this allow provides a resistivity that is exactly between the Isaohm (133µΩcm) and Manganin (43µΩcm) alloys. This offers users an even more targeted selection of high-precision resistance alloys.

Believed to be the world's most advanced optical bonding technology, Distec uses the VacuBond high performance silicone optoGel. The manufacturing equipment is capable of directly bonding TFT displays in custom bezels and front housings with integrated protective glass. Moreover, the VacuBond process is reversible: individual components can be recovered, simplifying repairs and reducing repair costs.

  Computrol has purchased patent-pending Flood Box technology for inline cleaning from Technical Devices Company. Installed at Computrol’s Idaho facility, Computrol will benefit from lower costs and easier compliance with environmental standards.

Enabling porous or dense aluminium oxide (Al2O3) coatings on heat-sensitive substrates for industrial metallisation applications, Picodeon has developed its ultra-short pulsed laser deposition (USPLD) surface coating technology. Porous Al2O3 layers are used for instance as filters and electrical insulation layers. Dense Al2O3 is used as a barrier layer and is also an excellent optical coating with high transmittance properties.

  The THERMADOSE line of hot melt production equipment has been introduced by Fisnar Europe. The hot melt systems provide pulse-free, temperature controlled, thermoplastic dispensing for industrial applications using pressure-sensitive adhesives, contact adhesives, waxes and sealants.