Component Management

Offering enhanced electronics performance with improved fastener resistance to vibrational loosening, drop shock and high heat, the self-locking Spiralock micro threaded inserts have been introduced by STANLEY Engineered Fastening. The internal thread form design securely and cost-effectively attaches components in compact electronic assemblies.

Addressing the concepts around light curing adhesives, Intertronics has introduced a whitepaper: 'Designing-in Light Curing Adhesives' by Peter Swanson, Managing Director, Intertronics. The paper starts with the design function; design engineers will earn the gratitude of their production engineering colleagues if they can specify or allow for a light curing adhesive.

Formulated to operate over a wide temperature range of -62 to +343°C, Master Bond EP17HT-LO is a one part epoxy for bonding, sealing, coating and encapsulation. The low viscosity system has very low exotherm upon curing and can be cast in sections up to 0.5" in thickness. EP17HT-LO offers convenient handling, requires no mixing and has an unlimited working life at room temperature.

As high performance electronics spreads across a wide range of applications, it has stimulated a growing need to provide new innovative thermal materials that can effectively manage the heat dissipation challenges. To meet this need Parker Chomerics is constantly evolving its range of THERM-A-GAP thermally conductive dispensing gels in order that customers can maintain both system performance and reliability. 

Enabling designers to rapidly construct PCB cans at minimal cost for development purposes, Harwin now offers its EZ-Shield Can EMC protection screening products in kit form. To form an EMC cage around sensitive ICs and electronic circuitry, the company's EZ-Shield Cans are simply pressed onto pre-positioned surface mount EZ-Shield Clips. This saves expensive, labour-intensive secondary assembly and facilitates reworking.

  Designed to provide protection for sensitive PCB circuitry against RFI and EMI at board level, the S02 series of low profile RFI shield cans has been released by Harwin. Depending on frequency and configuration, attenuation performance of up to 24dB can be achieved.

Designed for structural-bonding applications requiring high thermal performance with absorption of mechanical stresses, the Bond-Ply LMS-HD has been released by Bergquist. The laminate material consists of a thermally conductive low-modulus silicone compound coated on a cured core and double lined with protective films.

SCHOTT is offering its HermeS wafers with hermetically sealed solid “Through Glass Vias” (TGV). HermeS glass substrates enable fully gastight and therefore long-term robust enclosures for MEMS devices. The fine pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. Since HermeS glass can be placed directly under the silicon MEMS, it makes miniaturized, fully hermetic 3D Wafer Level ...

Designed specifically for very large PCBs, the Summit LXi carries forward the proven performance of the LX platform with a complete update to thermal process controls. The LXi’s control system eliminates the effects of facility variations and supports more precise calibration, allowing process parameters to be readily shared between systems in multiple locations.

The Weller WXR Rework Station is designed to handle all tasks related to soldering, desoldering, and the use of hot air in the production process, saving significant costs compared to buying individual units. It is available from Farnell element14. The WXR 3 is a 3-channel station with an enormous total power output of 600 watts, higher than any other station on the market.