Component Management

DuPont Microcircuit Materials has introduced a suite of stretchable electronic ink materials for use in smart clothing applications and other wearable electronics. The materials provide an elegant, manufacturing-ready alternative to many traditional methods of embedding electronics in clothing.

3D technology, which combines the versatility of the two-shot MID moulding process with the speed and precision of LDS, has been introduced by Molex. While meeting stringent medical grade guidelines, the MediSpec Moulded Interconnect Device/Laser Direct Structuring (MID/LDS) technology delivers integrated fine-pitch 3D circuitry in a single moulded package suitable for high density medical devices.

It is well known that stainless steel is difficult to bond, and durable bonded connections are often only enabled through pretreatment. DELO Industrial Adhesives and the Ulm University of Applied Sciences have recently discovered that laser-pretreated stainless steel bondings are nearly as durable as after Sandblasting And COating (SACO) pretreatment.

Designed to minimise impedance discontinuities in high-speed military and aerospace data and telecomms devices that are intended for use in harsh environments, the Rigid Flex Circuits and Assemblies have been released by Molex. The assemblies feature the company’s rigid flex circuitry which combine the benefits of flexible copper circuitry and rigid PCB circuitry into a single power and signal solution to provide higher reliability at ...

In order to proactively seek out opportunities for the deployment of graphene, 2-DTech has developed a progressively closer relationship with the University of Manchester. The two parties have signed a memorandum of understanding that will see them sharing their respective resources and expertise, as well as the cross-pollination of ideas.

A method of removing contamination from process rollers, which has been developed though research work into the upscaling of plastic electronics production, has been introduced by Teknek. The research found that the process rollers used in a production line can be a major source of particulate contamination which can lead to defects such as scratches and dents on the film.

Morgan Advanced Materials has highlighted the benefits of its Active Brazing Alloy (ABA) process to join metals to ceramics in a variety of applications where conventional metallisation and brazing are either costly or impractical. The ABA process is currently used in specialist applications in sectors including medical and aerospace.

  Werner Turck has invested sustainably in the expansion of its production facilities. With the Paraquda multifunctional centre from Essemtec, the electronics manufacturer already meets the technical requirements of tomorrow.

As more and more high performance electronics are utilised across a wide range of applications, there is a growing need to provide innovative thermal materials that can effectively manage heat dissipation challenges. In line with this need, Parker Chomerics is constantly evolving its range of THERM-A-GAP thermally conductive dispensing gels in order for customers to maintain both system performance and reliability.

Digicom Electronics has published a white paper, titled 'Cleanliness of PCB Assemblies Leads to Medical Device Reliability'. The paper explains how design and manufacturing conditions, along with myths about board cleanliness and contamination, have exacerbated the cleanliness problem, and shows how cleaning can eliminate board contamination for medical devices.