Component Management
Growth in hydrocyclone demand drives further investment
A further significant investment in Morgan Advanced Materials capability has been made to produce high-specification ceramic hydrocyclone liners at its manufacturing facility in Rugby, Warwickshire, UK, following unprecedented levels of demand from the oil & gas sector. The investment involves the recruitment of five new employees as well as additional kilning and grinding capacity to satisfy increased demand from South East Asian and Af...
Automated thermocompressive bonding enables 3D die stacking
imec and Besi have announced the joint development of an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a fully intact 300mm wafer. The solution features high accuracy and high throughput, paving the way to a manufacturable 2.5D, 3D, and 2.5D/3D hybrid technology.
Cup-type plating lab equipment for wafers offers equivalent films to mass-production machines
Tanaka Holdings has announced that Electroplating Engineers of Japan, Limited (EEJA), which operates the Tanaka Precious Metals' plating business, has developed and launched the RAD-Plater cup-type ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines.
Epoxy meets NASA low outgassing requirements
Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications. This two component system has a low mixed viscosity of 1,000-3,000cps with a mix ratio of 100:80 by weight. It features an exceptionally long open time of at least 2-3 days at room temperature in a 100g batch and requires oven curing.
Snap cure conductive adhesive suits stringing solar modules
Designed to electrically interconnect solar cells using ribbons, the EMS 561-403 low-cost snap cure conductive adhesive has been unveiled by Engineered Materials Systems. The adhesive is stress absorbing to withstand the rigours of thermal cycling and features excellent conductive stability to cell and ribbon metallisation during damp heat exposure.
Whitepaper explores the benefits of in-house microbial-controlled clean rooms
Valtronic has announced a whitepaper, Why your medical microelectronics development partner needs both particulate- and microbial-controlled clean rooms, which explains what microbial-controlled clean rooms are and why they are beneficial to medical device manufacturers today.
BTU PYRAMAX reflow ovens meet Fuji dual lane requirements
BTU International has successfully launched its Fuji compliant dual lane conveyor solution on the PYRAMAX family of reflow ovens used for PCBs. This dual lane solution is fully compliant with Fuji Machine automated surface mount placement lines providing up to two lanes of travel to a maximum width of 320.5mm per lane. A lane-to-lane minimum distance of 46mm can be achieved. The conveyor is also capable of operating in a single lane mode wit...
High purity nobium suits use in superconducting accelerators
ULVAC has announced that it has developed a high-purity niobium material for superconducting accelerators. Superconducting accelerators are expected to be used in a wide variety of areas, including researching the origin of the universe by International Linear Colliders (ILC) in particle physics, analysing protein structure and partitioning and transmuting of high-level radioactive waste using nuclear transmutation in environmental and energy sci...
Saline Lectronics installs the ISM2000 intelligent storage solution
Storage solutions has announced that Saline Lectronics has purchased and installed an ISM2000 intelligent storage management machine, with sales and service by Juki. The ISM2000 will support the Juki lines by ensuring that materials are in the right place at the right time.
Monomolecular organic films seal porous low- k materials
At SEMICON West, imec announced that it has demonstrated concept and feasibility for pore-sealing low-k dielectrics in advanced interconnects. The method, based on the self-assembly of an organic monolayer, paves the way to scaling interconnects beyond N5.