Component Management

As well as a water-cooled standard solution with adjustable ventilation system, there are several additional options for large and high-mass boards, primarily a power cooling unit as an extended cooling tract or a bottom cooling system. The Rehm company has also designed the first coolant-water-free reflow soldering system, which utilises liquid nitrogen cooling. Rehm's VisionX range transforms the classic cooling tract into a two or four-layer s...

Count On Tools, Inc. (COT) has  announced the launch of its new QWIKTRAY system, developed to provide low-cost, custom matrix trays for many types of electronic components. QWIKTRAY allows surface mount components to be picked up in a repeatable method when tape-and-reel is not available and standard JEDEC trays do not exist. Users do not need to place these components by hand.

Photo Stencil, LLC, a provider of high-performance stencils and tooling, has announced that Susan Holmes, the company's Vice President of Engineering and Customer Service, will present her Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the Annual International Wafer-Level Packaging Conference during Session 10 on Wednesday 14th October.

Morgan Advanced Materials has made two additions to its range of crucible coatings for the foundry sector. PRO and STAR Coatings have been formulated to reduce impurities and so optimise the quality of the molten metal and the final cast product.  

Graphene, a flat sheet of graphite just one carbon atom thick, displays unique optical and electronic properties for use in future devices. In particular, graphene is nearly transparent to light and other EM waves, making it useful for LCDs and LEDs. However, some researchers want to make graphene absorb more EM radiation so that other proposed applications, such as photodetectors and solar cells, can be realised.

Rainbow Technology Systems, the company behind the Rainbow Process PCB production system, will launch a Singulation System for use with digital imaging systems at this year’s productronica exhibition - Munich Exhibition Centre, 10th to 13th November.

Techsil has launched SnapSil TN8000 silicone adhesive into the UK market. It is said to be a versatile, high performance silicone adhesive sealant that exhibits excellent corrosion-free adhesion to many substrates such as metals (including copper), plastics, PPO/PPE, ceramics and glass without the use of primers.

Kurtz Ersa North America will exhibit at the SMTA Austin (CTEA) Expo & Tech Forum, scheduled to take place Tuesday, October 20, 2015 at the Norris Conference Center in Austin ,TX.  Exhibits will include the new Smartflow 2020 selective soldering system.

According to Henkel, LOCTITE Si 5611 provides good gap filling and sealing capacity along with high durability and resistance to humidity as well as UV radiation. Typical applications include the production of solar and lighting systems, illuminated signage, switches and electronic connectors.

STI Electronics, Inc. has introduced a PCB Process Sequence Teaching Aid, the IPC-A-600. It is designed as an aid to individuals teaching the IPC-A-600 Acceptability of Printed Boards Training and Certification Programme. The IPC-A-600 PCB Process Sequence Teaching Aid is also said to be ideal for anyone in need of visual aids to assist with explaining the various steps of the PCB fabrication process.