/> The launch of Intel® Atom™ Processor E6XX series presents a possibility for small form factor COM modules in high-volume and cost-sensitive applications that require extremely low power consumption and passive heat dissipation. The first member in the family of COM modules from Hectronic based on Intel® Atom™ Processor E6XX series is the H6055 Qseven Module measuring 70mm x 70mm. H6055 targets embedded applications such as in-vehicle infotainment systems, battery powered handheld devices and industrial automation. “This platform from Intel is the perfect fit for the Qseven form factor, bringing advantages such as higher integration and a richer feature set with maintained computing performance, to cost-sensitive applications. We will be able to offer semi-custom solutions based on the H6055 COM module which incorporates all the components of a PC mounted on an application specific carrier board using the cost-efficient MXM connector close to the cost of single board computer solutions,” says Patrik Björklund, Sales and Marketing Manager at Hectronic AB.

The H6055 Qseven module is based on Intel® Atom™ Processor E6XX (600MHz, 1GHz and 1.3GHz, up to 1GB RAM) and has support for a range of storage options. The I/O feature set includes Gigabit Ethernet, PCIe, USB, SATA, LPC and CAN. Samples will be available to selected OEM customers in Q1, 2011. The H6055 Qseven module is specified for industrial temperature (–40°C to +85°C) upon introduction.

Technical support is provided directly from Hectronic’s development team in Uppsala, near Stockholm, Sweden.

Hectronic is an Affiliate Member of the Intel® Embedded Alliance, a community of embedded developers and solution providers.