Hectronic announces extended temperature COM modules with Intel Atom

This product announcement adds two temperature ranges, from –25°C to +70°C and from –40°C to +85°C. Conformal coating of the board is optional. Product samples will be available to OEM customers in the second quarter of 2010 and volume production will begin during the second half of the year. These COM modules target applications in markets like transportation, defense, test and measurement as well as process control and industrial automation. “Our customers require COM modules with reliable operation in harsh environments since their products often are installed in places with an uncontrolled climate and are used in outdoor equipment and portable applications. Hectronic has a tradition in offering robust products specified for extended temperature to be used in demanding applications. We have an extensive experience in the manufacturing technologies and test procedures required,” says Patrik Björklund, Sales and Marketing Manager at Hectronic.

H6046 and H6049 are based on a 1.1 GHz or 1.6 GHz Intel® Atom Z510/Z530 CPU and Intel® System Controller Hub US15W. H6046 has onboard PCI Express to PCI and LPC to ISA bridges. The H6046 in the 1.6 GHz version supports the ETX 3.0 standard which means that SATA is supported. Both COM modules have soldered DDRII memories for improved resistance to shock and vibration. The ETX module has onboard sockets for industrial Flash SSD and SD cards. The Qseven module has a soldered onboard BGA Flash SSD. The H6046 and H6049 have an approximate power consumption of 7 Watts and 5 Watts respectively. H6049 targets highly integrated and compact volume products that require low production costs. Measuring 70 mm x 70 mm it is well suited for handheld devices.