Communications
H6818 Ivy Bridge based COM Express Compact Module from Hectronic
Hectronic has announced the H6818, a Computer-on-Module in the COM Express Compact form factor and based on third generation Intel Core i3/i5/i7 processors (also called Ivy Bridge) and the new Mobile Intel QM77 Express chipset. The combination offers increased performance per watt and improved graphics and media processing capabilities compared with previous generation Intel Core i3/i5/i7. H6818 supports COM Express revision 2.1 and pin-out type 6 for full utilization of the advantages in the processor platform.
The H6818 has extensive I/O capabilities based on features in the Mobile Intel QM77 Express chipset. USB 3.0 increases data transfer speeds to and from the system. H6818 provides 4 USB 3.0/2.0, 4 USB 2.0, 2 SATA 3.0 ports with speed up to 6Gb/s, 2 SATA 2.0 ports with up to 3Gb/s, 1 SMBus, 1 I2C, and 4-bit input and 4-bit output GPIO for device controls. Additional expansion possibilities are 1 PCIe x16 slot, for instance for a video capture card or a high-end graphics card, and 1 PCIe x4 and 3 PCIe x1 or 7 PCIe x1 slot.
Hectronic is an Affiliate member of the Intel Intelligent Systems Alliance, a global ecosystem of 200+ member companies that provide the performance, connectivity, manageability, and security developers need to create smart, connected systems. Hectronic is also an associate member of PICMG, a consortium of companies who collaboratively develop open specifications for high performance telecommunications and industrial computing applications. PICMG manages the PICMG COM.0 standard also known as COM Express.