Hectronic announces H6052, a COM Express module based on the new Intel Core i5 and Core i7 processors

The H6052 computer board is ideal for embedded applications that require extensive computing performance in combination with low power consumption and compact size. Targeted application areas are datacom, telecom, industrial automation, medical or transportation. “This platform from Intel will introduce new possibilities for high performance embedded computing applications, giving us the chance to work with a wider range of OEM customers,” says Patrik Björklund, Sales and Marketing Manager at Hectronic AB.

The feature set of H6052 includes common interfaces in the COM Express standard such as PCI, PCI Express, SDVO and LVDS as well as an onboard Intel® 82577 Gigabit Ethernet Controller. Prototypes of the H6052 COM Express module will be demonstrated after January 7, 2010 and early access units are expected to be available to key OEM customers in the second quarter of 2010. A version of H6052 optimised by Hectronic for extended temperature operation is planned for introduction later this year. To meet the extended temperature specification, Hectronic will use the standard temperature parts available from Intel, and then screen and test each board in a wide temperature range.

Technical support is provided directly from Hectronic's development team in Uppsala, near Stockholm, Sweden.

Hectronic is an Affiliate Member of the Intel® Embedded Alliance, a community of embedded developers and solution providers.