3D NAND flash technology targets industrial and embedded markets

ATP will showcase these solutions and related products at the Flash Memory Summit 2016 from 9^th-11^th August, at the Santa Clara Convention Center, meeting room #205.

3D NAND technology is a transformational shift from the traditional SLC/MLC/TLC planar NAND technologies. It has become the new flash storage technology of choice, primarily focusing on both the client and enterprise SSD markets today. Inevitably the 3D NAND usage will propagate to the embedded markets such as industrial, IoT, medical, automotive and telecomms. To be at the forefront of this technology shift, ATP has taken the initiative to adopt 3D NAND for its next-gen embedded SSDs, in order to gain early understanding on the ins and outs of 3D NAND under extreme conditions, in order to better provide the solutions suitable for these niche markets where traditionally SLC/MLC technologies were deployed.

In addition, by taking 3D NAND wafers to package its own BGAs and TSOPs and testing to specifications, ATP is able to provide a multitude of various chip densities using DDP, QDP and even ODP die-stacking while using the same wafer stock. This provides not only the flexibility in supply chain, but also enables ATP to ramp multiple product densities quickly. These new ATP 3D NAND solutions benefit the embedded customers with the high reliable, high available yet cost-effective storage solutions while mitigating supply risks in this volatile market. In addition, at the FMS 2016 show, ATP will also share its experiences in addressing the challenges due to NAND technology limitations by the demanding embedded application requirements, with a presentation titled 'Optimising Embedded SSDs for Performance and Beyond: A Prevention-Report-Analysis', on 10^th August, from 3:50-4:55pm at the Open Session 203-B, and also on 11^th August, from 10:15-10:30AM at the FMS Theater.