ATP has debuted its first NVMe based M.2 2280 SSD offering twice the performance of SATA-based SSDs. This newest generation SSD is designed to meet the storage demand of I/O intensive data processing and low latency requirement for industrial and mission critical applications, including surveillance, medical imaging, and many network- storage systems with fast caching requirement.

ATP Electronics is expanding and relocating its European Headquarters to Max-Planck-Str. 5, D-85716 Unterschleißheim Germany. The expansion of the EU office will serve the company’s growing memory business in the area, largely driven by the increasing demand for ATP’s 3D NAND based solutions. Over the past 2 years, ATP has gradually added to the European technical and sales team in order to provide comprehensive local suppo...

Manufacturer of embedded Flash and ruggedised SSD and DRAM modules, ATP Electronics, will reveal its new 3D NAND-based SATA product line up at embedded world 2017 in Nuremberg. The products have gone through stringent chip as well as module level validation tests and will be manufactured using ATP’s in-house self-packaging technology. Available form factors include 2.5”, mSATA, SlimSATA and M.2 in various capacities, including interme...

A complete product line of ATP Electronics' next-gen storage solutions are being displayed at Embedded Technology 2016. They have been designed, manufactured, and tested from NAND wafer to finished SSD. Product line displays include industrial temperature MLC and SLC memory cards, and embedded SSDs utilising 3D NAND flash.

ATP has announced the industry’s first DDR3L ECC SODIMM technology capable of operating at 1866MHz. The ATP DDR3L-1866 modules are available with capacities of 4GB and 8GB and address the need for low voltage (1.35V) DDR3 memory running at 1866MHz (instead of 1600 MHz). As a result they can maximise system performance when used in conjunction with Intel Apollo Lake processors.

A manufacturer of embedded Flash and ruggedised SSD and DRAM modules, ATP, announces its next gen storage solutions utilising the latest 3D NAND flash technologies. Combined with ATP’s wafer packaging and testing capabilities, these lines of 3D NAND based SSDs including M.2, mSATA, SlimSATA, 2.5” SSD, eUSB and memory cards, provides a new level of product differentiation targeting the industrial and embedded markets.

ATP will be introducing its comprehensive automotive solutions and the latest SATA III products at Embedded World 2016 at the Nuremberg Exhibition Centre, Germany from February 23rd to 25th. ATP’s booth is located at Hall 1, #655. ATP’s all-inclusive Automotive Solution Set, covering quality, manufacturing, testing, engineering and supply chain capabilities, provides the future-proof technology and the customer-oriented service p...

ATP will be introducing its comprehensive automotive solutions and the latest SATA III products at the upcoming Embedded World 2016 at the Nuremberg Exhibition Centre, Germany from February 23rd to 25th. ATP booth is located at Hall 1, 655.

At Embedded Technology 2015, 18th to 20th November in Yokohama, Japan, ATP will showcase its storage solutions from its booth located at #F-24-08. Highlights will include new high density aMLC/MLC SD3.0 UHS-I SD/microSD, CF/CFast, 2.5” SSD and other embedded flash modules, which are suitable for automotive applications.