High-density BNC suits pick-and-place manufacturing
A 75 Ohm High-Density BNC solution (HDBNC Series) with an exclusive, balanced right-angle design ideal for high volume pick-and-place manufacturing (-BM1D & -BM2D die-cast options) has been released by Samtec.
Designed primarily for use in advanced broadcast video equipment, the HDBNC Series was tested to the latest SMPTE 2082 12G-SDI pass/fail specifications, with return loss measurements surpassing minimum requirements by a least -10 dB from 0 – 12 GHz.
Results also show extremely low VSWR and insertion loss. Details, including complete Product Specifications and Characterization Reports, are available at samtec.com?HDBNC-BM.
Product design was optimised and provides increased surface area to ensure proper vacuum sealing, while weight modifications ensure balance during pick-and-place onto the printed circuit board.
Samtec’s HDBNC-BM1D & -BM2D die-cast products maintain a compact design for increased panel density with 8 mm (.315") body height and 8.5 mm (.335") width.
Body height matches current screw-machined right-angle HDBNC Series designs for easier adaptability to existing applications.
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