Samtec, Inc. announces availability in production quantities of AcceleRate Slim Direct-Attach Cable Assemblies, the industry’s slimmest cable system.

Samtec has announced full production quantity availability of its LL043 Series Nitrowave high-performance microwave cable assembly.

Samtec announces availability of its SLH/TLH Series printed circuit board (PCB) to board (B2B) connectors that offer an ultra-low mated stack height down to 2mm (.078") and support 28Gbps NRZ performance.

Samtec will be demonstrating next-generation, high-performance optical and copper interconnect solutions at electronica 2024.

Samtec, a service provider in the connector industry, will be showcasing its next-generation high-performance optical and copper interconnect solutions at the upcoming OCP Global Summit. 

Samtec announces immediate availability of its SS4/ST4 Series ultra micro printed circuit board (PCB) connectors that offer an ultra-fine 0.40mm pitch, enabling maximum signal density at 28Gbps NRZ performance.

Samtec will demonstrate next-generation, high-performance optical and copper interconnect solutions at the upcoming ECOC exhibition, Europe’s largest optical communications exhibition.

Samtec is now offering a variety of board-level and cable connector systems for JTAG applications that are currently shipping in volume quantities.

Samtec, a service provider in the connector industry, has unveiled new additions to its A-Series family, now featuring a Level 3 Product Part Approval Process (PPAP) package tailored for automotive applications. 

Samtec’s ganged, multi-port SMPM Magnum RF product family is now available with a low-profile 3.94mm (.155") body height, right-angle option for maximum channel density in low- or mid-band systems. Samtec’s GPPC Series offers the industry’s first low-profile, right-angle multi-port solution with performance out to 50 GHz.

Samtec has announced availability of its NovaRay cable assemblies that combine extreme density and performance by using 40% less space than traditional arrays to support 112 Gbps PAM4 per channel. Applications include datacom, AI/ML, HPC, computer and semiconductor, medical, test and measurement, military/aerospace, and mobile networks.

Samtec, one of the service leaders in the connector industry, has announced the details of its participation in IMS 2024, the International Microwave Symposium Exhibition, to be held in Washington DC 18– 20 June 2024.

Samtec, the service specialist in the connector industry, has expanded its Sudden Service offerings with SIBORG, a free tool designed to allow Samtec customers the opportunity to optimise their component launches.

Samtec has released a new line of RF Edge launch connectors with a narrow body design that is 33% smaller than traditional Edge launch connectors.

Samtec has expanded its line of Edge Rate board-to-board connectors to include a higher density mated set that is half the width of previous designs and offers a lower-profile 5mm mated height (ERF6 and ERM6 Series).

Samtec will have a large presence at DesignCon 2024, with 11 planned talks, sponsorship of the event’s Welcome Reception, and a booth on the show floor (#939) showcasing high-speed interconnect solutions for applications up to 224 Gbps PAM4. Samtec is a Diamond level sponsor of the event.

Samtec is now shipping the Optical FireFly Micro Flyover System, the first interconnect system with the flexibility to use micro-footprint high-performance optical and copper interconnects interchangeably.

Samtec’s Generate high-speed edge card sockets (HSEC6-DV Series) support 64 Gbps PAM4 (32 Gbps NRZ) applications and are PCIe 6.0 capable.

Samtec, the service provider for the connector industry, has enhanced its open-pin-field arrays to simultaneously run analog, digital, and power signals.

Samtec has fully released its line of vertical solderless, compression mount connectors that incorporate precision alignment features.