12mm mated connector sets supporting high speed

VITA 42 XMC defines an open standard for supporting high speed, switched interconnect protocols on an existing, widely deployed form factor.

This revision further defined the concept for the preferred Standard connectors in XMC applications including:

• Solder ball attachment replaced Paste-On-Pad (POP) for improved solder joints.
• Low Insertion Force (LIF) sockets to ease mating and un-mating.
• Tin-lead alloy available as a solder option.
• Revised ASP catalogue numbers.
• 12mm stack height.

Based on these guidelines, Samtec is proud to release 12mm stack height options expanding the existing family of ANSI/VITA 42 XMC Standard connectors. Chosen for high reliability stemming from the multipoint-of-contact SamArray sockets and robust solder ball design, the updated connector set has been specified for current XMC systems.

Samtec's growing catalogue of XMC connectors enable switched communication between a mezzanine card and its carrier. In addition to transmitting sensitive high-speed data, these connectors provide power, ground, and auxiliary signals to the mezzanine. The 12mm mated connector set further optimises XMC cards for use in wider modules, designed for 1.00" pitch cage systems.

David Givens, Standards Director, stated: “We were excited at the opportunity to update VITA 42.0, bringing the specified connectors to the state-of-the-art. Since the Standard was launched, Samtec supported hundreds of system designers who expressed the need for an alternative to Paste-On-Pad attachments while providing Low Insertion Force contacts.”