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Thermal Clad dielectric provides superior heat transfer for high power lighting LED applications

13th May 2010

ES Admin

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Optimised for high-power LED lighting and other applications requiring enhanced heat-transfer efficiency, Bergquist’s new HPL dielectric for Thermal-Clad substrates enables lower operating temperatures, higher LED driving currents, and reduced component count leading to simplified design and assembly.

The new dielectric has an extremely high thermal conductivity of 3.0W/m-K , resulting in a very low thermal resistance of only 0.13°Ccm2/W. The dielectric thickness is 38µm, and is available on all Bergquist Thermal Clad aluminium and copper Insulated Metal Substrates (IMS). Displaying vastly superior thermal performance compared to standard FR4 PCBs, Thermal Clad HPL is supplied as scored array circuits, scored singulated circuits, or punched singulated parts.

By efficiently removing heat generated from surface-mounted high-power LEDs, Thermal Clad HPL promotes reliability by minimising the operating temperature for a given LED driving current. Engineers thus gain extra freedom to optimise light output, component count and lumen maintenance in equipment such as energy-saving lamps, LED-based bulb replacements, signage, stage lighting and display backlights.

With a maximum operating temperature of 150°C and continuous operating voltage of 170V DC (120V AC), the new dielectric can be used in a wide variety of environments and applications.